- ●By fully utilizing the cleaning and drying technologies we have nurtured through our work with semiconductors and flat panels, we are able to accommodate a variety of needs, such as high quality, low damage, etc.
- ●We can realize space and utility saving through flexible design in accordance with objects to be cleaned, and needs.
- ●We can realize the removal of microscopic foreign matter through the combination of double-sided brushes, two-flow jets, pure-jets that apply ultrasonics, and high-pressure jets, etc.
- ●We can propose equipment that can handle wafer type and rectangular substrates in a wide variety of sizes.
- ●We can also produce dry processors (UV processing, etc.)
![](http://www.clean-s-tec.co.jp/smd_corp/wp-content/themes/stec_corp/images/product016.jpg)
![](http://www.clean-s-tec.co.jp/smd_corp/wp-content/themes/stec_corp/images/product002.jpg)
![](http://www.clean-s-tec.co.jp/smd_corp/wp-content/themes/stec_corp/images/product007.jpg)
![](http://www.clean-s-tec.co.jp/smd_corp/wp-content/themes/stec_corp/images/product004.jpg)
![](http://www.clean-s-tec.co.jp/smd_corp/wp-content/themes/stec_corp/images/product017.jpg)